(module DFN-12-1EP_4x4mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
  (descr "DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CE.PDF)")
  (tags "DFN 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -3.075) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DFN-12-1EP_4x4mm_Pitch0.65mm (at 0 3.075) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -1.0 -2.0) (end 2.0 -2.0) (layer F.Fab) (width 0.15))
  (fp_line (start 2.0 -2.0) (end 2.0 2.0) (layer F.Fab) (width 0.15))
  (fp_line (start 2.0 2.0) (end -2.0 2.0) (layer F.Fab) (width 0.15))
  (fp_line (start -2.0 2.0) (end -2.0 -1.0) (layer F.Fab) (width 0.15))
  (fp_line (start -2.0 -1.0) (end -1.0 -2.0) (layer F.Fab) (width 0.15))
  (fp_line (start -2.4 -2.35) (end -2.4 2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.4 -2.35) (end 2.4 2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.4 -2.35) (end 2.4 -2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.4 2.35) (end 2.4 2.35) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.52 2.15) (end 1.52 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.225 -2.15) (end 1.52 -2.15) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -1.835 -1.625) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.835 -0.975) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.835 -0.325) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.835 0.325) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -1.835 0.975) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -1.835 1.625) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 1.835 1.625) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 1.835 0.975) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 1.835 0.325) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1.835 -0.325) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 1.835 -0.975) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.835 -1.625) (size 0.63 0.36) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 0.66 1.3275) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at 0.66 0.4425) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at 0.66 -0.4425) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at 0.66 -1.3275) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at -0.66 1.3275) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at -0.66 0.4425) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at -0.66 -0.4425) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 13 smd rect (at -0.66 -1.3275) (size 1.32 0.885) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/DFN-12-1EP_4x4mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
