(module QFN-36-1EP_6x6mm_Pitch0.5mm (layer F.Cu) (tedit 589C398D)
  (descr "http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BN%20.pdf p509")
  (tags "QFN-0.5 36SQFN-3706-6x6B")
  (attr smd)
  (fp_text reference REF** (at 0 -4.25) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value QFN-36-1EP_6x6mm_Pitch0.5mm (at 0 5.4) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2 -3) (end 3 -3) (layer F.Fab) (width 0.1))
  (fp_line (start 3 -3) (end 3 3) (layer F.Fab) (width 0.1))
  (fp_line (start 3 3) (end -3 3) (layer F.Fab) (width 0.1))
  (fp_line (start -3 3) (end -3 -2) (layer F.Fab) (width 0.1))
  (fp_line (start -3 -2) (end -2 -3) (layer F.Fab) (width 0.1))
  (fp_line (start -3.48 -3.48) (end -3.48 3.48) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.48 -3.48) (end 3.48 3.48) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.48 -3.48) (end 3.48 -3.48) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.48 3.48) (end 3.48 3.48) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.1 -3.1) (end 3.1 -2.3) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.1 3.1) (end -3.1 2.3) (layer F.SilkS) (width 0.12))
  (fp_line (start 3.1 3.1) (end 3.1 2.3) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.1 3.1) (end -2.3 3.1) (layer F.SilkS) (width 0.12))
  (fp_line (start 3.1 3.1) (end 2.3 3.1) (layer F.SilkS) (width 0.12))
  (fp_line (start 3.1 -3.1) (end 2.3 -3.1) (layer F.SilkS) (width 0.12))
  (fp_line (start -2.3 -3.1) (end -3.1 -3.1) (layer F.SilkS) (width 0.12))
  (fp_line (start -3.1 -3.1) (end -3.1 -2.3) (layer F.SilkS) (width 0.12))
  (fp_circle (center -3.4 -3.4) (end -3.2 -3.4) (layer F.SilkS) (width 0.12))
  (pad 1 smd rect (at -2.775 -2) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.775 -1.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.775 -1) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.775 -0.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.775 0) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -2.775 0.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -2.775 1) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -2.775 1.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -2.775 2) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at -2 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at -1.5 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at -1 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at -0.5 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 0 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 0.5 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 1 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 1.5 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 2 2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 2.775 2) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 2.775 1.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at 2.775 1) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd rect (at 2.775 0.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd rect (at 2.775 0) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd rect (at 2.775 -0.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 25 smd rect (at 2.775 -1) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 26 smd rect (at 2.775 -1.5) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 27 smd rect (at 2.775 -2) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 28 smd rect (at 2 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 29 smd rect (at 1.5 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 30 smd rect (at 1 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 31 smd rect (at 0.5 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 32 smd rect (at 0 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 33 smd rect (at -0.5 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 34 smd rect (at -1 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 35 smd rect (at -1.5 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 36 smd rect (at -2 -2.775 90) (size 0.9 0.28) (layers F.Cu F.Paste F.Mask))
  (pad 37 smd rect (at 0 0) (size 3.7 3.7) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.1))
  (model Housings_DFN_QFN.3dshapes/QFN-36-1EP_6x6mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
