(module QFN-20-1EP_4x4mm_Pitch0.5mm (layer F.Cu) (tedit 54130A77)
  (descr "20-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -3.33) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value QFN-20-1EP_4x4mm_Pitch0.5mm (at 0 3.33) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -1.0 -2.0) (end 2.0 -2.0) (layer F.Fab) (width 0.15))
  (fp_line (start 2.0 -2.0) (end 2.0 2.0) (layer F.Fab) (width 0.15))
  (fp_line (start 2.0 2.0) (end -2.0 2.0) (layer F.Fab) (width 0.15))
  (fp_line (start -2.0 2.0) (end -2.0 -1.0) (layer F.Fab) (width 0.15))
  (fp_line (start -2.0 -1.0) (end -1.0 -2.0) (layer F.Fab) (width 0.15))
  (fp_line (start -2.6 -2.6) (end -2.6 2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.6 -2.6) (end 2.6 2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.6 -2.6) (end 2.6 -2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.6 2.6) (end 2.6 2.6) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.15 -2.15) (end 2.15 -1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 -2.15) (end -1.375 -2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 -2.15) (end 1.375 -2.15) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -1.965 -1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.965 -0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.965 0) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.965 0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -1.965 1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -1 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -0.5 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0.5 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 1.965 1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.965 0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 1.965 0) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 1.965 -0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 1.965 -1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 1 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.5 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 0 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at -0.5 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at -1 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at 0.625 0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at 0.625 -0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at -0.625 0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at -0.625 -0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/QFN-20-1EP_4x4mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
