(footprint "ST_WLCSP-72_Die415" (version 20211014) (generator pcbnew)
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  (tedit 5AE11EAD)
  (descr "WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf")
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  (pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 11e07619-df1a-45db-b7db-107c4c1d3889))
  (pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4f5b2961-c1fc-456f-873e-dd918005dcd3))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-72_Die415.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
