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    (solder_paste_margin_ratio 0.055556) (tstamp 789f1b8f-dce0-40e4-b334-ccaf80acf1dc))
  (pad "H9" smd circle (at 1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 05c94725-814a-424e-a839-701730804107))
  (pad "J1" smd circle (at -1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6eecf81b-56a4-470f-b02b-d15c4c5ddb57))
  (pad "J2" smd circle (at -1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6af12fc7-2764-4086-a519-d4af0d0c3d48))
  (pad "J3" smd circle (at -0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8df3a826-17cb-4c80-a711-4dc98ae9f0f5))
  (pad "J4" smd circle (at -0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d315029d-46fd-4428-bf7c-e04eb1d644c7))
  (pad "J5" smd circle (at 0 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d15fdfbe-7ce0-4ecb-b0a0-41d8a2cf9166))
  (pad "J6" smd circle (at 0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a9943540-d899-4da2-91ba-f4fd7d61eb95))
  (pad "J7" smd circle (at 0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 203fb16c-1bfa-4e91-a5dc-31a8b5680176))
  (pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4c4c9d6b-34ac-4e71-bd3b-57f1e13a6b8c))
  (pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b6faee73-8414-41a5-a105-9a362bcf58e9))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-81_Die415.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
