(footprint "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5DC5FE76)
  (descr "SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13), generated with kicad-footprint-generator ipc_gullwing_generator.py")
  (tags "SOIC SO")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.4) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4f58ceb2-dac0-4a46-9d6b-e158eb6f30b9)
  )
  (fp_text value "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm_ThermalVias" (at 0 3.4) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 2b700002-1caa-4ec4-a603-b6d6d49d0b85)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.98 0.98) (thickness 0.15)))
    (tstamp f669df7f-3af0-4b81-9e91-fe2d7fd0397b)
  )
  (fp_line (start 0 2.56) (end -1.95 2.56) (layer "F.SilkS") (width 0.12) (tstamp 51f81fa0-53ab-47ab-a948-2a1a83ba820a))
  (fp_line (start 0 -2.56) (end 1.95 -2.56) (layer "F.SilkS") (width 0.12) (tstamp 735bde61-69dd-4cd0-bd08-7d55a1bb4eca))
  (fp_line (start 0 2.56) (end 1.95 2.56) (layer "F.SilkS") (width 0.12) (tstamp a0a6b214-31b1-413b-9d80-0125ddf2fd16))
  (fp_line (start 0 -2.56) (end -3.45 -2.56) (layer "F.SilkS") (width 0.12) (tstamp a58e61d1-44fa-4916-ab10-06555f0e9a0e))
  (fp_line (start 3.7 2.7) (end 3.7 -2.7) (layer "F.CrtYd") (width 0.05) (tstamp 202fff96-bfc9-4e9f-96f2-1e734d09976f))
  (fp_line (start -3.7 2.7) (end 3.7 2.7) (layer "F.CrtYd") (width 0.05) (tstamp 21b57a26-01ac-43ca-87d6-d48f143382be))
  (fp_line (start -3.7 -2.7) (end -3.7 2.7) (layer "F.CrtYd") (width 0.05) (tstamp 78ef7a40-78b8-4b44-8a3b-bf47cb4fc563))
  (fp_line (start 3.7 -2.7) (end -3.7 -2.7) (layer "F.CrtYd") (width 0.05) (tstamp 81ec6a1b-a5de-47f9-be11-439d2f3f8521))
  (fp_line (start -1.95 -1.475) (end -0.975 -2.45) (layer "F.Fab") (width 0.1) (tstamp 01057023-9be0-4abe-90e7-a69bb7bbdd39))
  (fp_line (start -0.975 -2.45) (end 1.95 -2.45) (layer "F.Fab") (width 0.1) (tstamp 037849fc-5b40-4bd2-a157-5150ca54deaa))
  (fp_line (start -1.95 2.45) (end -1.95 -1.475) (layer "F.Fab") (width 0.1) (tstamp c1def78a-dbc1-48fa-bf38-8f6db1d0742f))
  (fp_line (start 1.95 2.45) (end -1.95 2.45) (layer "F.Fab") (width 0.1) (tstamp d16d8502-121e-49a8-963a-84d3d0570ca2))
  (fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer "F.Fab") (width 0.1) (tstamp ff1804f1-31e1-40f2-863e-dad970a0ec28))
  (pad "" smd roundrect (at -0.63 -0.8) (size 1.05 1.34) (layers "F.Paste") (roundrect_rratio 0.238095) (tstamp 80027ac5-b858-4c69-ad21-be94ce0e5cb0))
  (pad "" smd roundrect (at 0.63 0.8) (size 1.05 1.34) (layers "F.Paste") (roundrect_rratio 0.238095) (tstamp adf9ee31-d14b-497f-90f3-c7f96ae22578))
  (pad "" smd roundrect (at 0.63 -0.8) (size 1.05 1.34) (layers "F.Paste") (roundrect_rratio 0.238095) (tstamp da61e047-f2bd-4ab8-bfb9-ac230a29d379))
  (pad "" smd roundrect (at -0.63 0.8) (size 1.05 1.34) (layers "F.Paste") (roundrect_rratio 0.238095) (tstamp dad80c65-4371-4b0c-9936-f307ab91c897))
  (pad "1" smd roundrect (at -2.6375 -1.905) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6793f338-28a0-4927-aa50-2696b165703a))
  (pad "2" smd roundrect (at -2.6375 -0.635) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 3145da39-cdd4-431f-99ca-e622da7e7fae))
  (pad "3" smd roundrect (at -2.6375 0.635) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9a67cbeb-7f1f-43f2-a3ea-79eda14f5668))
  (pad "4" smd roundrect (at -2.6375 1.905) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 836839f9-2cf6-451c-a34d-75b2a1699b14))
  (pad "5" smd roundrect (at 2.6375 1.905) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 2ab7fc7e-ccc9-40e4-99b0-7df98402ec40))
  (pad "6" smd roundrect (at 2.6375 0.635) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 162c688a-f16b-4568-8acc-5ba07663f4eb))
  (pad "7" smd roundrect (at 2.6375 -0.635) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 03beb87b-1e03-43c0-bfed-01dbafc71840))
  (pad "8" smd roundrect (at 2.6375 -1.905) (size 1.625 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ab9c9276-4d92-4086-84ff-c7c6b6188148))
  (pad "9" thru_hole circle (at 0.7 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 62064d6d-8160-4511-a86c-435eee86bc6f))
  (pad "9" thru_hole circle (at -0.7 -1) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 9f512ebf-c44d-439a-ac79-3c799fe7849c))
  (pad "9" thru_hole circle (at -0.7 1) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp a879aeeb-330a-4470-b3f0-b16d89af2f78))
  (pad "9" thru_hole circle (at 0.7 1) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp c9f52a6e-2d45-4389-b1d2-9d6d2f79ed19))
  (pad "9" thru_hole circle (at -0.7 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp cd0f9c2b-4213-46c8-80a3-9dce29e4db17))
  (pad "9" smd rect (at 0 0) (size 1.9 2.5) (layers "B.Cu") (tstamp d6cc0a0e-6eaf-4ca0-a55c-f1acf1909790))
  (pad "9" thru_hole circle (at 0.7 -1) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp f0c99f9a-3d77-4294-b704-8eda58d1e37c))
  (pad "9" smd rect (at 0 0) (size 2.514 3.2) (layers "F.Cu" "F.Mask") (tstamp f705ae46-f1e8-4814-984a-ba0e725b984a))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
