(footprint "InvenSense_QFN-24_3x3mm_P0.4mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 61FED23A)
  (descr "24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)")
  (tags "QFN 0.4")
  (attr smd)
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    (tstamp ef4cb44a-c63f-4f85-912c-08664c7f4012)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 3f2362a0-b170-41c4-a9a8-27963e526593)
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  (fp_text user "No Copper" (at 0 -0.1) (layer "Cmts.User")
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    (tstamp 744046d5-37e6-4b0d-8d6b-4a258093b2d8)
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    (tstamp 75c2d1ed-1ee1-4f7a-8a72-8dc7534e222b)
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    (tstamp ab33ed5f-c5cd-4afa-936a-768a54dcf0ee)
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    (effects (font (size 0.2 0.2) (thickness 0.04)))
    (tstamp dff5552f-fcd9-4b2b-a091-78ee18f0da10)
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    (tstamp 32ecea21-4c75-4ef4-a8df-625f6ef28e21)
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  (zone (net 0) (net_name "") (layer "F.Cu") (tstamp c2521796-c56e-43f1-9b89-ee1243e51e7b) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
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        (xy 0.875 0.795)
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  )
  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-24_3x3mm_P0.4mm_EP1.7x1.54mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
