(footprint "ST_WLCSP-144_Die470" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf")
  (tags "BGA 144 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1df7a3b7-dd3d-46e8-8615-8bac4668e7fc)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9bf61156-09fd-48c2-9dcf-43af98a79076)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0ff86bed-8b6f-4244-b131-200e9ea6adbd)
  )
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    (solder_paste_margin_ratio 0.055556) (tstamp b1011001-3c38-4b1d-af0f-d2ca4f0eb69b))
  (pad "M11" smd circle (at 1.8 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "M12" smd circle (at 2.2 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5b5bbce7-91f9-41f8-9e25-9191fe9ab341))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-144_Die470.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
