(footprint "WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B5DBBC6)
  (descr "WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf")
  (tags "BGA 56 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b7ec9391-8226-4c0a-8b52-471665b83f89)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b775bb9e-4ace-4c8d-afbf-b437069f1ad7)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.74 0.74) (thickness 0.111)))
    (tstamp d86f20a9-a070-449c-8bfc-1ddc898c68fb)
  )
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    (solder_paste_margin_ratio 0.055556) (tstamp 2417c1d3-7fdf-48f1-89ad-61f9dda0b3fb))
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    (solder_paste_margin_ratio 0.055556) (tstamp ffad88d7-ce70-43bb-838a-f99c52b44e1a))
  (pad "H6" smd circle (at 0.8 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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    (solder_paste_margin_ratio 0.055556) (tstamp 9a1b6fdc-9327-4837-9eb3-6faa668cea39))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
