(module Nexperia_WLCSP-15_6-3-6_2.37x1.17mm_Layout6x3_P0.4mm (layer F.Cu) (tedit 6390C239)
  (descr "Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf")
  (tags "CSP 15 0.4")
  (attr smd)
  (solder_mask_margin 0.0375)
  (fp_text reference REF** (at 0 -1.585) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value Nexperia_WLCSP-15_6-3-6_2.37x1.17mm_Layout6x3_P0.4mm (at 0 1.585) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 1.185 0.585) (end -1.185 0.585) (layer F.Fab) (width 0.1))
  (fp_line (start -1.185 0.585) (end -1.185 -0.2925) (layer F.Fab) (width 0.1))
  (fp_line (start -1.185 -0.2925) (end -0.8925 -0.585) (layer F.Fab) (width 0.1))
  (fp_line (start -0.8925 -0.585) (end 1.185 -0.585) (layer F.Fab) (width 0.1))
  (fp_line (start 1.185 -0.585) (end 1.185 0.585) (layer F.Fab) (width 0.1))
  (fp_line (start -2.19 -1.59) (end -2.19 1.59) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.19 1.59) (end 2.19 1.59) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.19 1.59) (end 2.19 -1.59) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.19 -1.59) (end -2.19 -1.59) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.0475 -0.785) (end 1.385 -0.785) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.385 -0.785) (end 1.385 0.785) (layer F.SilkS) (width 0.12))
  (fp_line (start 1.385 0.785) (end -1.385 0.785) (layer F.SilkS) (width 0.12))
  (fp_line (start -1.385 0.785) (end -1.385 -0.4475) (layer F.SilkS) (width 0.12))
  (pad A1 smd circle (at -1 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad A2 smd circle (at -0.6 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad A3 smd circle (at -0.2 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad A4 smd circle (at 0.2 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad A5 smd circle (at 0.6 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad A6 smd circle (at 1 -0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad C1 smd circle (at -1 0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad C2 smd circle (at -0.6 0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad C3 smd circle (at -0.2 0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad C4 smd circle (at 0.2 0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad C5 smd circle (at 0.6 0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad C6 smd circle (at 1 0.4) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad B1 smd circle (at -0.8 0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad B2 smd circle (at 0 0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (pad B3 smd circle (at 0.8 0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste))
  (fp_text user ${REFERENCE} (at 0 0) (layer F.Fab)
    (effects (font (size 0.55 0.55) (thickness 0.0825)))
  )
  (model ${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/Nexperia_WLCSP-15_6-3-6_2.37x1.17mm_Layout6x3_P0.4mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
